[Other] Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure

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sunglin Post time 2024-4-29 08:44:03 | Show all posts |Read mode
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journal£ºInternational Symposium on Microelectronics

Authors£ºEric Ouyang; MyoungSu Chae; Seng Guan Chow; Roger Emigh; Mukul Joshi; Rob Martin; Raj Pendse

Published date£º2010-1-1

DOI£º10.4071/isom-2010-tp2-paper1

PDF link£ºhttp://meridian.allenpress.com/i ... 2010-tp2-paper1.pdf

Article link£ºhttp://dx.doi.org/10.4071/isom-2010-tp2-paper1

Article Source£ºIMAPS - International Microelectronics Assembly and Packaging Society¡£


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