[Elsevier] Influence mechanism of Au layer thickness on wettability of Sn每Ag每Cu solder on heated ENIG pads

Cooper Post time 2024-4-26 10:44:46 | Show all posts |Read mode
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journalㄩVacuum

AuthorsㄩJie Wang; Qian Sun; Xiao Xia Tang; Xiao Nan Wang; Kato Akira

Published dateㄩ2022-7-

DOIㄩ10.1016/j.vacuum.2022.111074

PDF linkㄩhttps://www.sciencedirect.com/sc ... 042207X22002044/pdf

Article linkㄩhttp://dx.doi.org/10.1016/j.vacuum.2022.111074

Article SourceㄩElsevier BV


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NORANISAH Post time 2024-4-26 10:44:47 | Show all posts

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