Multi-point thermal monitoring of silicon wafer under processing utilizing a spectrally shaped supercontinuum source

Post time 2024-4-22 12:05:19

journal：High-Power Laser Materials Processing: Applications, Diagnostics, and Systems XIII

Authors：Sarthak Dash; Abhigyan Goswami; Rashmita Deheri; Sushobhan Avasthi; V. R. Supradeepa

Published date：2024-3-12

DOI：10.1117/12.3002717

Article link：http://dx.doi.org/10.1117/12.3002717

Article Source：SPIE。

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Post time 2024-4-22 12:05:20

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[SPIE] Multi-point thermal monitoring of silicon wafer under processing utilizing a spectrally shaped supercontinuum source

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[SPIE] Multi-point thermal monitoring of silicon wafer under processing utilizing a spectrally shaped supercontinuum source