Pressureless Sintered-Silver as Die Attachment for bonding Si and SiC Chips on Silver, Gold, Copper, and Nickel Metallization for Power Electronics Packaging: The Practice and Science

Post time 2024-4-16 18:49:45

journal：IEEE Journal of Emerging and Selected Topics in Power Electronics

Authors：Meiyu Wang; Yunhui Mei; Weibo Hu; Xin Li; Guo-Quan Lu

Published date：2022-4-

DOI：10.1109/jestpe.2022.3150223

PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=9707763

Article link：http://dx.doi.org/10.1109/jestpe.2022.3150223

Article Source：Institute of Electrical and Electronics Engineers (IEEE)。

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Post time 2024-4-16 18:49:46

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[IEEE] Pressureless Sintered-Silver as Die Attachment for bonding Si and SiC Chips on Silver, Gold, Copper, and Nickel Metallization for Power Electronics Packaging: The Practice and Science

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[IEEE] Pressureless Sintered-Silver as Die Attachment for bonding Si and SiC Chips on Silver, Gold, Copper, and Nickel Metallization for Power Electronics Packaging: The Practice and Science