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[IEEE] Advanced HDFO Packaging Solutions for Chiplets Integration in HPC Application

serpant Post time 2024-4-16 14:05:44 | Show all posts |Read mode
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journal£º2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

Authors£ºLihong Cao Teck Lee; Yungshun Chang; SimonYL Huang; JY On; Emmal Lin; Owen Yang

Published date£º2021-6-

DOI£º10.1109/ectc32696.2021.00013

PDF link£ºhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=9501736

Article link£ºhttp://dx.doi.org/10.1109/ectc32696.2021.00013

Article Source£ºIEEE¡£


Remark£º

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Rajavarman11 Senior Member
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