[Other] Sintered nanosilver paste for high-temperature power semiconductor device attachment

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formyscience Post time 2022-7-3 17:29:59 | Show all posts |Read mode
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journal£ºInternational Journal of Materials and Product Technology

Authors£ºJesus N. Calata; Thomas G. Lei; Guo Quan Lu

Published date£º2009--

DOI£º10.1504/ijmpt.2009.022406

Article link£ºhttp://dx.doi.org/10.1504/ijmpt.2009.022406

Article Source£ºInderscience Publishers¡£


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