Comprehensive search ChatGPT Online Scientific research tools
Sign in Sign Up

Science hub Mutual Aid community


[Emerald] Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere

isthebest Post time 2024-5-8 18:07:14 | Show all posts |Read mode
Reward10points

journal£ºSoldering & Surface Mount Technology

Authors£ºBifu Xiong; Siliang He; Jinguo Ge; Quantong Li; Chuan Hu; Haidong Yan; Yu-An Shen

Published date£º2024-1-10

DOI£º10.1108/ssmt-07-2023-0034

PDF link£ºhttps://www.emerald.com/insight/ ... -2023-0034/full/xml

Article link£ºhttp://dx.doi.org/10.1108/ssmt-07-2023-0034

Article Source£ºEmerald¡£


Remark£º

Best Answer

chunking17 Junior Member
2024-5-8
Please adopt

View Full Content

You can support us by donating, we would be very grateful.
Reply

Use magic Donate Report

All Reply1 Show all posts
chunking17 Post time 2024-5-8 18:07:15 | Show all posts

This post has been completed

Completed attachments will be deleted within 24 hours.
You can support us by donating, we would be very grateful.
Reply

Use magic Donate Report

isthebest Lv.2
Junior Member

  • post

  • reply

  • points

    55

Same Category

Latest Reply

Announcement

Enthusiastic users today

Return to the list