[Springer] A critical review of the preparation strategies of thermally conductive and electrically insulating polymeric materials and their applications in heat dissipation of electronic devices

Post time 2024-5-10 23:41:00

Journal: Advances on Thermally Conductive Epoxy-Based Composites as Electronic Packaging Underfill Materials—A Review
Authors：Chenggong Zhao; Yifan Li; Yicheng Liu; Huaqing Xie; Wei Yu

Published date: 2022-12-28

DOI: 10.1007/s42114-022-00584-2

Article link：https://link.springer.com/article/10.1007/s42114-022-00584-2#citeas

Post time 2024-5-10 23:41:01

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