journal£º2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Authors£ºNiall P. Williams; Daniel Trimble; S¨¦amus M. O'Shaughnessy
Published date£º2023-5-30
DOI£º10.1109/itherm55368.2023.10177593
PDF link£ºhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10177593
Article link£ºhttp://dx.doi.org/10.1109/itherm55368.2023.10177593
Article Source£ºIEEE¡£
Remark£º |