journal£ºJournal of Electronic Packaging
Authors£ºAbhishek Deshpande; Qian Jiang; Abhijit Dasgupta; Ulrich Becker
Published date£º2022-9-1
DOI£º10.1115/1.4051647
PDF link£ºhttp://asmedigitalcollection.asm ... p_144_03_031006.pdf
Article link£ºhttp://dx.doi.org/10.1115/1.4051647
Article Source£ºASME International¡£
Remark£º |