[Other] Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors

 Close Closed
tracy110 Post time 2024-5-9 15:37:39 | Show all posts |Read mode
Reward20points

Edited by tracy110 at 2024-5-10 10:52

journal£ºJournal of Electronic Packaging

Authors£ºMei-Chien Lu

Published date£º2022-6-1

DOI£º10.1115/1.4052069

PDF link£ºhttp://asmedigitalcollection.asm ... p_144_02_020801.pdf

Article link£ºhttp://dx.doi.org/10.1115/1.4052069

Article Source£ºASME International¡£


Remark£º
Reply

Use magic Donate Report

All Reply0 Show all posts

Reply

You have to log in before you can reply Login | Register

Points Rules

Junior Member
  • post

  • reply

  • points

    230

Latest Reply

Return to the list