[Other] Integration of copper with low-k dielectrics for 0.13 ¦Ìm technology

sunglin Post time 2024-5-9 10:18:00 | Show all posts |Read mode
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journal£ºProceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)

Authors£ºJ. Gambino; A. Stamper; T. McDevitt; V. McGahay; S. Luce; T. Pricer; B. Porth; C. Senowitz; R. Kontra; M. Gibson; H. Wildman; A. Piper; C. Benson; T. Standaert; P. Biolsi; E. Cooney

Published date£º--

DOI£º10.1109/ipfa.2002.1025628

PDF link£ºhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=1025628

Article link£ºhttp://dx.doi.org/10.1109/ipfa.2002.1025628

Article Source£ºIEEE¡£


Remark£º

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wer123v Post time 2024-5-9 10:18:01 | Show all posts

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