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[Elsevier] Controlling the thermal aging and Kirkendall void diffusion speed of sputtered silver interlayers in GaN power semiconductor packaging interfaces for in-wheel motor system integrations

isthebest Post time 2024-5-2 16:33:20 | Show all posts |Read mode
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journal£ºCorrosion Science

Authors£ºDongjin Kim; Chuantong Chen; Sangmin Lee; Min-Su Kim; Katsuaki Suganuma

Published date£º2024-1-

DOI£º10.1016/j.corsci.2023.111614

PDF link£ºhttps://www.sciencedirect.com/sc ... 010938X23006571/pdf

Article link£ºhttp://dx.doi.org/10.1016/j.corsci.2023.111614

Article Source£ºElsevier BV¡£


Remark£º

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zpsukhan Post time 2024-5-2 16:33:21 | Show all posts

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