[Other] Progress of Interconnect Materials in the Third-generation Semiconductor and Their Low-temperature Sintering of Copper Nanoparticles

formyscience Post time 2024-5-2 03:30:21 | Show all posts |Read mode
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journal£ºJournal of Inorganic Materials

Authors£ºXin KE; Bingqing XIE; Zhong WANG; Jingguo ZHANG; Jianwei WANG; Zhanrong LI; Huijun HE; Limin WANG

Published date£º2024--

DOI£º10.15541/jim20230345

Article link£ºhttp://dx.doi.org/10.15541/jim20230345

Article Source£ºShanghai Institute of Ceramics¡£


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smahata Post time 2024-5-2 03:30:22 | Show all posts

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