Reducing CFx residue from Etching Process by Optimizing Post Plamsa Treatment

Post time 2024-4-29 19:32:15

journal：2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Authors：Ki Dong Yang; Heeseong Yang; Eunyoung Han; Youngeun Kim; Taehee Han; Young Jeong Kim; Nuri Lim; Jungyup Lim; Joong Jung Kim

Published date：2023-5-1

DOI：10.1109/asmc57536.2023.10121107

PDF link：https://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=10121107

Article link：http://dx.doi.org/10.1109/asmc57536.2023.10121107

Article Source：IEEE。

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Post time 2024-4-29 19:32:16

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[IEEE] Reducing CFx residue from Etching Process by Optimizing Post Plamsa Treatment

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