[Other] Development of Novel Conditioning Method Using Thermal Shape Memory Characteristics of Polyurethane CMP Pad

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joe035656 Post time 2024-4-29 11:38:12 | Show all posts |Read mode
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journal£ºECS Journal of Solid State Science and Technology

Authors£ºJangwon Seo; Sanghuck Jeon; Jongwook Yoon; Joonho An; Yongsoo Choi; Hyunho Seok; Seunghwan Lee; Pengzhan Liu; Wookyung Jeon; Taesung Kim

Published date£º2024-3-31

DOI£º10.1149/2162-8777/ad2cfc

PDF link£ºhttps://iopscience.iop.org/article/10.1149/2162-8777/ad2cfc

Article link£ºhttp://dx.doi.org/10.1149/2162-8777/ad2cfc



Remark£ºArticle Source£ºThe Electrochemical Society¡£
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