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[IEEE] Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for Low Cost and High Performance Flip Chip Package

sunglin Post time 2024-4-29 08:45:54 | Show all posts |Read mode
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journal£º2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

Authors£ºNokibul Islam; Vinayak Pandey; KyungOe Kim

Published date£º2017-5-

DOI£º10.1109/ectc.2017.216

PDF link£ºhttps://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=7999678

Article link£ºhttp://dx.doi.org/10.1109/ectc.2017.216

Article Source£ºIEEE¡£


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