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[ACS] Low Temperature Sintered Silver Nanoflake Paste for Power Device Packaging and Its Anisotropic Sintering Mechanism

formyscience Post time 2022-7-3 14:29:17 | Show all posts |Read mode
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journal£ºACS Applied Electronic Materials

Authors£ºChuncheng Wang; Gang Li; Liang Xu; Junjie Li; Dailin Zhang; Tao Zhao; Rong Sun; Pengli Zhu

Published date£º2021-12-28

DOI£º10.1021/acsaelm.1c00857

Article link£ºhttp://dx.doi.org/10.1021/acsaelm.1c00857

Article Source£ºAmerican Chemical Society (ACS)¡£


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2022-7-3
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