journal£º2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
Authors£ºLy May Chew; Tamira Stegmann; Erika Schwenk; Wolfgang Schmitt
Published date£º2019-12-
DOI£º10.1109/eptc47984.2019.9026669
Article link£ºhttp://dx.doi.org/10.1109/eptc47984.2019.9026669
Article Source£ºIEEE¡£
Remark£º |