[IEEE] Die Attachment on Bare Copper Surface by Non-Pressure Silver Sintering in Inert Atmosphere

formyscience Post time 2022-7-3 13:42:14 | Show all posts |Read mode
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journal£º2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

Authors£ºLy May Chew; Tamira Stegmann; Erika Schwenk; Wolfgang Schmitt

Published date£º2019-12-

DOI£º10.1109/eptc47984.2019.9026669

Article link£ºhttp://dx.doi.org/10.1109/eptc47984.2019.9026669

Article Source£ºIEEE¡£


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David Post time 2022-7-3 13:42:15 | Show all posts

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