[Other] [Other]Localization and Characterization of Defects for Advanced Packaging Using Novel EOTPR Probing Approach and Simulation

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journal：International Symposium for Testing and Failure Analysis

Authors：Chuan Zhang; Jane Y. Li; John Aguada; Jonathon Elliott; Somayyeh Rahimi; Christian Schmidt; Howard Marks; Tom White; Jesse Alton; Brett Gibson; Martin Igarashi

Published date：2020-12-1

DOI：10.31399/asm.cp.istfa2020p0245

Article link：http://dx.doi.org/10.31399/asm.cp.istfa2020p0245

Article Source：ASM International。

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[Other] [Other]Localization and Characterization of Defects for Advanced Packaging Using Novel EOTPR Probing Approach and Simulation