Laser vs. Blade Dicing for Direct Bonded Heterogeneous Integration (DBHi) Si Bridge

Post time 2022-12-2 00:40:06

journal：2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

Authors：Aakrati Jain; Kamal Sikka; Juan-Manuel Gomez; Dishit Parekh; Marc Bergendahl; Jeroen van Borkulo; Kees Biesheuvel; Roman Doll; Mark Mueller

Published date：2021-6-

DOI：10.1109/ectc32696.2021.00184

Article link：http://dx.doi.org/10.1109/ectc32696.2021.00184

Article Source：IEEE。

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[IEEE] Laser vs. Blade Dicing for Direct Bonded Heterogeneous Integration (DBHi) Si Bridge

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