[IOP] A review of silicon-based wafer bonding processes, an approach to realize the monolithic integration of Si-CMOS and III–V-on-Si wafers

yyyddd Post time 2024-4-15 16:55:06 | Show all posts |Read mode
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发表期刊:Journal of Semiconductors

作者:Shuyu Bao;王玥;Khaw Lina;张莉;王冰;瓦尔达纳·阿吉·萨桑卡;Kenneth Eng Kian Lee;苏金蔡;尤尔根·米歇尔;尤金·菲茨杰拉德;谭川成;李

光宏 发布日期:2021-2-1

DOI:10.1088/1674-4926/42/2/023106

PDF链接:https://iopscience.iop.org/article/10.1088/1674-4926/42/2/023106

文章链接:http://dx.doi.org/10.1088/1674-4926/42/2/023106



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文章来源:IOP Publishing

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